Thermal Engineering Services

ATOA's THERMAL ENGINEERING SERVICES

Most of energy generated is wasted as an unproductive heat in most of the mechanical devices. Further, more than 30 % is energy produced is used for building thermal  and climate control.  Thermal management plays a key role in efficient utilization of energy. Temperature becomes the limiting factor for most of the applications. The increase in temperature also increases the cost of the product due to increase in high temperature material cost. Waste heat recovery, thermodynamic efficiency improvement, Super insulation, Natural  and sustainable climate control are growth trends. At cae.atoa, we offer thermal simulation analysis encompassing all forms of heat transfer (Conduction, convection and radiation), constituent material and macro engineering behavior for efficient thermal performance design. Our Coupled Thermal analysis specialty include, Conjugate Heat transfer for electronic components, gas turbine, oil and gas pipes, Coupled Thermal and electrical analysis for Induction heating, RF heating, microwave heating and biomedical therapy.

Thermal Engineering Simulation Solutions

We provide basic Thermal engineering simulations for,

• Heat transfer analysis of devices and systems with liquids, solids and gases.

• Building Thermal Energy and Climate Management

• Data center Thermal and Energy Management

• Industrial HVAC performance prediction and optimisation

• Engineered material design for insulation and high thermal conductivity

• Heat transfer in porous media

• Heat exchanger design for thermal management of Industrial machines and  electronic devices.

Multiphysics Thermal Engineering Simulation Solutions

Our Speciality coupled MULTIPHYSICS CAE for Thermal Engineering includes,

• Thermal + Electrical: Electromagnetic Heating (Resistive, RF Induction, Microwave), Electro thermal actuation, Thermoelectric effects.

• Bioheat transfer simulation for RF ablation, AC/DC heating, IR heating  for medical therapy  

• Thermal + Structural: Thermal stress due to thermal expansion, actuation.

• Thermal + Flow : Conjugate heat transfer with laminar and turbulent flow, material processing simulation.

• Thermal + Chemical: Phase change Physics based thermal management

• Thermal + Wave: Radiative heat transfer, Fluorescence effects

• Thermal + Acoustics: Thermo acoustical effects, Ultrasonic  

Emerging Thermal Engineering

Our focus on emerging technologies related to Thermal Engineering are,

• Nano, meta and photonic structured surfaces for superior multilevel heat transfer for efficient cooling or heat extraction.

• Engineered materials for Superinsulation, directional heat transfer,  Near zero thermal expansion, extremely high thermal conductivity and on demand thermal conductivity (insulator to conductor)  as a  function of temperature.

• Natural convection and evaporation based cooling for low cost Building thermal management, water storage and refrigeration.

• Thermoelectric  waste heat recovery systems.

ATOA’s  New addition to  Thermal Engineering Solutions,

• 3D Printing of Thermal scale down Models and engineering surfaces models.

• Thermal Engineering design apps for U value, R value, Thermal conductivity, Energy saving, Thermal product performance prediction.

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We do Thermal analysis to predict, Thermal insulation (U value) or resistance ( R value), Thermal transmittance or conductance (k value prediction), heat dissipation, and overall Thermal performance and management, under Steady state and transient heat transfer conditions.  Material design for higher thermal conductivity or for other extreme of lowest thermal conductivity or ultra low thermal insulation. Virtual thermal conductivity measurement for material and product systems. Our Research and innovation services on offers exploits, Nanoscale heat transfer for superior performance , for example, Knudsen effect engineered for ultra low thermal conductivity which is less than still air and Thermal phonon tunnelling for maximum thermal conductivity and Maximum heat dissipation with

Contact ATOA for advanced Thermal Engineering simulation solutions at cae@atoa.com

Thermal Keywords

Thermal Basics : Conduction, Convection, Radiation, Heat Transfer, Thermal Shock, Heat Dissipation, Insulation, Conductivity, Resistance, U-value, R-value.

Thermal Multiphysics: Conjugate Heat transfer, Thermoelectricity, Thermal Stress, Joules Heat
Material Design: High k Materials, thermal conductivity, Ultra Low k Materials, Superinsulation, Selective Thermal Property, Materials

Thermal Applications:  Aerospace:  Engine, Thermal Shield, Defense, Emergency Shelter, Containers, Civil: Wall/glazing Panels, HVAC, Building Insulation, Consumer and Industrial: Refrigerator, Circuit Breaker, Compressors, Electronic Components, Heat Pump,

Energy: Generators, Motors, Solar Thermal, Fuel Cell, Electrical Vehicles.

 Computational Thermal Mechanics

Introduction to Thermal Mechanics

Thermal mechanics is a crucial field of engineering that deals with the behavior of materials and structures under thermal loading conditions. It encompasses the study of heat transfer, thermal stresses, and the effects of temperature variations on material properties. Understanding these principles is essential for designing systems that must operate efficiently and safely in environments with varying thermal conditions, such as aerospace, automotive, electronics, and civil engineering applications.

Use Cases in Thermal Mechanics

Thermal mechanics is applied across various industries and applications, including:

·             Aerospace Engineering: In the design of aircraft and spacecraft, where components must withstand extreme temperature variations during flight and re-entry.

·             Automotive Engineering: In the analysis of engine components, exhaust systems, and heat exchangers to ensure efficient thermal management.

·             Electronics: In the thermal management of electronic devices, such as integrated circuits and power electronics, to prevent overheating and ensure reliability.

·             Civil Engineering: In the design of buildings and structures that must endure thermal expansion and contraction due to temperature changes.

·             Energy Systems: In the analysis of thermal performance in power plants, solar collectors, and HVAC systems.

Basics of Thermal Mechanics

Thermal mechanics is based on fundamental principles of thermodynamics and heat transfer, focusing on how heat affects the performance and behavior of materials. Key concepts include:

·             Heat Transfer: The movement of thermal energy from one body or system to another, occurring through conduction, convection, and radiation.

·             Thermal Conductivity (k): A material property that quantifies how easily heat can pass through a material. High thermal conductivity materials, like metals, transfer heat quickly, while insulating materials, like plastics and ceramics, resist heat transfer.

·             Thermal Expansion: The tendency of materials to expand or contract in response to temperature changes, described by the coefficient of thermal expansion (𝜶).

·             Thermal Stress: Internal stresses generated within a material due to temperature variations, which can lead to deformation or failure if not properly managed.

·             Energy Conservation: The principle that energy cannot be created or destroyed, only transformed from one form to another. This principle governs thermal analysis and heat transfer calculations.

Types of Thermal Analysis

Thermal analysis can be categorized into several types:

·             Steady-State Analysis: Assumes that the temperature distribution within a system does not change with time. This approach is often used in heat exchanger design and thermal insulation analysis.

·             Transient Analysis: Considers time-dependent changes in temperature, applicable in scenarios where thermal conditions vary rapidly, such as startup or shutdown processes.

·             Coupled Thermal-Mechanical Analysis: Integrates thermal and mechanical analyses to understand how temperature variations affect structural integrity and performance.

Computational Models in Thermal Mechanics

Computational models are essential for analyzing complex thermal problems in engineering. Common methods include:

·             Finite Element Method (FEM): A numerical approach that divides a structure into smaller elements, allowing for detailed thermal analysis under varying conditions. FEM is widely used for both steady-state and transient thermal analyses.

·             Finite Difference Method (FDM): A technique that approximates differential equations by discretizing the domain into a grid, useful for solving heat conduction problems.

·             Computational Fluid Dynamics (CFD): Employed to analyze heat transfer in fluid systems, such as heat exchangers, by simulating fluid flow and temperature distribution.

Partial Differential Equations (PDE) in Thermal Mechanics

The behavior of thermal systems is governed by partial differential equations (PDEs) that describe heat transfer and thermal stresses. The most common equations in thermal mechanics include:

·             Heat Equation: Describes the distribution of heat (temperature) in a given region over time. It can be expressed as:

𝜕𝝩/𝜕t  = 𝜶 𝞩2 𝝩

               where 𝝩 is the temperature,   t is time, and  𝜶 is the thermal diffusivity of the material.

·             Fourier’s Law of Heat Conduction: Relates the heat flux to the temperature gradient within a material:

·               .q =  -𝝹 𝞩𝝩

               where q is the heat flux vector and 𝝹 is the thermal conductivity.

·             Energy Equation: Accounts for the conservation of energy in thermal systems, often used in coupled thermal-mechanical analyses.

Characteristics Material Properties

Typical required material properties in thermal mechanics include:

·             Thermal Conductivity (𝝹): Indicates a material’s ability to conduct heat.

·             Specific Heat Capacity (c): The amount of heat required to change a unit mass of a material by one degree Celsius, influencing thermal response during heating and cooling.

·             Coefficient of Thermal Expansion (𝜶): Determines how much a material expands or contracts with temperature changes.

·             Thermal Resistance (R): Represents a material’s ability to resist heat flow, often used in insulation applications.

·             Phase Change Properties: Characteristics of materials that undergo phase changes (e.g., melting, solidification) under varying temperature conditions.

Product Performance Characteristics

The performance characteristics of thermal systems designed using computational mechanics include:

·             Temperature Distribution: Understanding how temperature varies within a system during operation.

·             Thermal Stress Resistance: The ability of a material or structure to withstand thermal stresses without failing.

·             Heat Transfer Efficiency: The effectiveness of a system in transferring heat, crucial for heat exchangers and thermal management systems.

·             Response Time: The time it takes for a system to reach thermal equilibrium or respond to changes in thermal loading.

·             Durability: The ability of materials to maintain performance over time under varying thermal conditions.

 Summary of  Thermal Mechanics

The field of thermal mechanics within computational domains is essential for designing and analyzing systems subjected to thermal loads. With advancements in computational models, numerical methods, and innovative materials, engineers can create products that perform effectively in diverse thermal environments. Continuous evolution and integration of new technologies will further enhance the potential for innovation in thermal mechanics, ensuring that engineering solutions meet the challenges of modern applications.